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Ordering Information
Part Number
FAN3216TMX
Logic
Dual Inverting Channels
Input
Threshold
TTL
Package
SOIC-8
Packing
Method
Tape & Reel
Quantity
per Reel
2,500
FAN3216TMX_F085
(1)
Dual Inverting Channels
TTL
SOIC-8
Tape & Reel
2,500
FAN3217TMX
FAN3217TMX_F085 (1)
Dual Non-Inverting Channels
Dual Non-Inverting Channels
TTL
TTL
SOIC-8
SOIC-8
Tape & Reel
Tape & Reel
2,500
2,500
All standard Fairchild Semiconductor products are RoHS compliant and many are also “Green” or going green. Green means
the products are RoHS compliant AND they have limits on additional substances of Chlorine, Bromine and Antimony. For additional
information on Fairchild’s “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html .
Note:
1. Qualified to AEC-Q100
Package Outlines
Figure 3. SOIC-8 (Top View)
Thermal Characteristics (2)
Package
8-Pin Small Outline Integrated Circuit (SOIC)
Θ JL(3)
40
Θ JT(4)
31
Θ JA(5)
89
Ψ JB(6)
43
Ψ JT(7)
3.0
Unit
°C/W
Notes:
2. Estimates derived from thermal simulation; actual values depend on the application.
3. Theta_JL ( Θ JL ): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
4. Theta_JT ( Θ JT ): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
5. Theta_JA ( Θ JA ): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink using a 2S2P board, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
6. Psi_JB ( Ψ jB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For
the SOIC-8 package, the board reference is defined as the pcb copper adjacent to pin 6.
7. Psi_JT ( Ψ jT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 5.
? 2009 Fairchild Semiconductor Corporation
FAN3216 / FAN3217 ? Rev. 1.0.3
2
www.fairchildsemi.com
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